IoTeX and Polygon Announce Joint Initiative to Build Multi-Chain Interoperable DePIN Layer

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September 18, 2024
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On September 18th, official sources announced that IoTeX Co-Founder Raullen and Polygon Co-Founder Nailwal jointly declared the initiation of a cross-chain DePIN layer construction at the recently concluded Singapore 2049 DePIN themed summit "R3al World." This DePIN layer will be jointly supported by the IoTeX 2.0 DePIN modular platform and Polygon's blockchain aggregation layer AggLayer. This collaboration will provide improved cross-chain communication and liquidity expansion for DePIN modules integrated on IoTeX, enabling users to interact on their preferred chains.

In July, IoTeX officially announced its 2.0 DePIN modular strategy. Under this strategy, IoTeX will become a DePIN open infrastructure that transcends chain and ecosystem limitations, supporting all project teams. This collaboration with Polygon is a crucial step in pushing forward the construction of cross-ecosystem DePIN facilities. Raullen stated, "Our infrastructure will enable any DePIN developer to seamlessly connect with AggLayer, allowing users to interact with DePIN applications across multiple blockchains." In response, Polygon Co-Founder Nailwal added, "This integration not only opens up opportunities for Polygon in deep DePIN construction but also unlocks unprecedented liquidity and scalability opportunities for DePIN projects through AggLayer. By providing a dedicated platform that seamlessly connects different ecosystems, these projects can flourish in the multi-chain world."

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